A cutting device, possibly for cutting silicon wafers, utilising a stabiliser, possibly a liner voltage stabiliser comprising a first device 11 body with transmission 201, cutting 203 and mobile devices 202 all housed therein. A work cavity 12 with a lifting block 15 arranged therein which has a telescopic cavity 16, positioning blocks 78 and positioning cavity 79. A first gear 21 in cavity 18 and rotating shaft 19 cavity associated with a motor 20 in screw thread 17 arrangement is associated with telescopic cavity 16. A second gear cavity 22 with a gear 23 in power connection with the first gear 21, the second gear 22 fixed to a second rotating shaft 26 which extends in to a first transmission cavity 25. Third and fourth gears 27, 28 directly or indirectly interacting with second gear 23 and a wire winding cavity 30 is connected to a rotatory shaft 31 of fourth gear 28. A sliding cavity 34 is arranged in one side of wire winding cavity 30 and a sliding plate 36 arranged in a first sliding cavity 35 with a guide37 and associated spring 28.
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