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Nanosheet transistors with different gate dielectrics and workfunction metals

机译:具有不同栅极电介质和功函数金属的纳米片晶体管

摘要

Integrated chips include vertically stacked channel layers, with a first stack in a first device region and a second stack in a second device region. A first dielectric layer is formed conformally on the vertically stacked channel layers in the first device region. A second dielectric layer is formed conformally on the vertically stacked channel layers in the second device region. Gate conductors are formed around the vertically stacked channel layers in both the first device region and the second device region, filling a space between surfaces of the respective first dielectric layer and second dielectric layer.
机译:集成芯片包括垂直堆叠的沟道层,第一堆叠在第一器件区域中,第二堆叠在第二器件区域中。在第一器件区域中的垂直堆叠的沟道层上共形地形成第一介电层。第二介电层在第二器件区域中的垂直堆叠的沟道层上共形地形成。在第一器件区域和第二器件区域中的垂直堆叠的沟道层周围形成栅极导体,以填充相应的第一介电层和第二介电层的表面之间的空间。

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