Integrated chips include vertically stacked channel layers, with a first stack in a first device region and a second stack in a second device region. A first dielectric layer is formed conformally on the vertically stacked channel layers in the first device region. A second dielectric layer is formed conformally on the vertically stacked channel layers in the second device region. Gate conductors are formed around the vertically stacked channel layers in both the first device region and the second device region, filling a space between surfaces of the respective first dielectric layer and second dielectric layer.
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