This study is about the improvement of adhesiveness and heat resistance of the heat sink for hybrid integrated circuit board. In the current situation, when using adhesive to paste the heat shield (2) on the hybrid integrated circuit board (1), paste the printer board (1) on (1)）Not only there is no sliding method, but also the adhesive hardens, and bubbles are generated between the printing machine (1) and the heat sink (2), thus reducing the heat-resistant effect, which is the reason for the occurrence of product defects.In this study, on a hybrid integrated circuit printed board, in order to dissipate heat, the printer board is fixed on a heat-resistant board with adhesive,A mounting slot (3) is formed for placing the plane shape of the printer board (1),On the one hand, it is formed in the inner plane (3a) of the installation groove (3), on the other hand, it passes through the heat-proof plate (2) to the outside, forming a bubble release groove (4) of the upper crack structure, improving the viscosity, and being able to withstand the impact of external vibration or thermal pressure,By maximizing the heat release effect, the stable operation of the hybrid integrated circuit is ensured. As a result, the product has the advantages of direct connection with the improvement of reliability.
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