A novel cycloaliphatic triepoxide, 1,1-bis(2',3'-epoxycyclohexyloxymethyl)-3,4-epoxycyclohexane (II), and its precursor, 1, 1-bis(2 ' -cyclohexenyloxymethyl)-3-cyclohexene, were synthesized. Their chemical structures were confirmed with IR spectroscopy, elemental analysis, and H-1 NMR spectroscopy. 11 was easily cured with hexahydro-4-methylphthalic anhydride with 1,3,5-triethylhexahydro-s-triazine as a curing accelerator. The physical properties of the cured product were examined with thermomechanical analysis, thermogravimetric analysis, and dynamic mechanical analysis. Compared with the commercial diepoxide ERL-4221 under the same curing conditions, the cured product based on II showed a much higher glass-transition temperature (198 degreesC), a higher crosslinking density (2.08 X 10(3) mol/cm(3)), and a lower coefficient of thermal expansion [6.2 X 10(5)(/degreesC)]. II may become a promising candidate material for modern microelectronic packaging. (C) 2001 John Wiley & Sons, Inc.
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机译：一种新型的环脂族三环氧化物1,1-双（2'，3'-环氧环己氧基甲基）-3,4-环氧环己烷（II）及其前体1，1，双（2'-环己烯氧基甲基）-3-环己烯合成的。通过红外光谱，元素分析和H-1 NMR光谱确认了它们的化学结构。用1,3,5-三乙基六氢-s-三嗪作为固化促进剂，用六氢-4-甲基邻苯二甲酸酐容易地固化11。通过热力学分析，热重分析和动态力学分析来检查固化产物的物理性质。在相同的固化条件下，与市售二环氧环氧树脂ERL-4221相比，基于II的固化产物显示出更高的玻璃化转变温度（198℃），更高的交联密度（2.08 X 10（3）mol / cm（3） ）和较低的热膨胀系数[6.2 X 10（5）（/℃）]。 II可能成为现代微电子封装的有希望的候选材料。 （C）2001年John Wiley＆Sons，Inc.
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