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Non-homogeneous SiGe-on-insulator formed by germanium condensation process

机译:锗凝结工艺形成的非均质绝缘子上硅锗

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摘要

Ge condensation process of a sandwiched structure of Si/SiGe/Si on silicon-on-insulator (SOI) to form SiGe-on-insulator (SGOI) substrate is investigated. The non-homogeneity of SiGe on insulator is observed after a long time oxidation and annealing due to an increased consumption of silicon at the inflection points of the corrugated SiGe film morphology, which happens in the case of the rough surface morphology, with lateral Si atoms diffusing to the inflection points of the corrugated SiGe film. The transmission electron microscopy measurements show that the non-homogeneous SiGe layer exhibits a single crystalline nature with perfect atom lattice. Possible formation mechanism of the non-homogeneity SiGe layer is presented by discussing the highly nonuniform oxidation rate that is spatially dependent in the Ge condensation process. The results are of guiding significance for fabricating the SGOI by Ge condensation process. ? 2014 Chinese Physical Society and IOP Publishing Ltd.
机译:研究了绝缘体上硅(SOI)上Si / SiGe / Si夹层结构的Ge缩合过程,以形成绝缘体上SiGe(SGOI)衬底。经过长时间的氧化和退火后,观察到绝缘子上SiGe的不均匀性,这是由于在波纹SiGe薄膜形态拐点处硅的消耗增加,这种情况在表面形态粗糙的情况下发生,且侧面有Si原子扩散到瓦楞硅锗薄膜的拐点。透射电子显微镜测量表明,不均匀的SiGe层表现出具有完美原子晶格的单晶性质。通过讨论高度不均匀的氧化速率,提出了非均质SiGe层的可能形成机理,该速率在空间上取决于Ge缩合过程。该结果对锗凝结工艺制备SGOI具有指导意义。 ? 2014中国物理学会与IOP出版有限公司

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