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Developing a High Density Pt/Alumina Hermetic Feedthrough

机译:开发高密度pt /氧化铝密封馈通

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摘要

Typically, hermetic feedthroughs for implantable devices, such as pacemakers, use a alumina ceramic insulator brazed to a platinum wire pin. This combination of material has a long history in implantable devices and has been approved by the FDA for implantable hermetic feedthroughs. The growing demand for increased input/output (I/O) hermetic feedthroughs for implantable neural stimulator applications could be addressed by developing a new, cofired platinum/alumina multilayer ceramic technology in a configuration that supports 300 plus I/Os, which is not commercially available.Seven platinum powders with different particle sizes were used to develop different conductive cofire inks to control the densification mismatch between platinum and alumina. Firing profile (ramp rate, burn- out and holding times) and firing atmosphere and concentrations (hydrogen (wet/dry), air, neutral, vacuum) were also optimized. Platinum and alumina exhibit the alloy formation reaction in a reduced atmosphere. Formation of any compound can increase the bonding of the metal/ceramic interface, resulting in enhanced hermeticity. The feedthrough fabricated in a reduced atmosphere demonstrated significantly superior performance than that of other atmospheres. A composite structure of tungsten/platinum ratios graded thru the via structure (pure W, 50/50 W/Pt, 80/20 Pt/W and pure Pt) exhibited the best performance in comparison to the performance of other materials used for ink metallization.Studies on the high temperature reaction of platinum and alumina, previously unreported, showed that, at low temperatures in reduced atmosphere, Pt3Al or Pt8Al21 with a tetragonal structure would be formed. Cubic Pt3Al is formed upon heating the sample to temperatures above 1350 °C. This cubic structure is the equilibrium state of Pt-Al alloy at high temperatures. The alumina dissolves into the platinum ink and is redeposited as a surface coating. This was observed on both cofired samples and pure platinum thin films coated on a 99.6 Wt% alumina and fired at 1550 °C. Different mechanisms are proposed to describe this behavior based on the size of the platinum particle.
机译:通常,用于可植入设备(例如起搏器)的气密性穿通线使用钎焊到铂金线针上的氧化铝陶瓷绝缘体。这种材料的组合在可植入设备中具有悠久的历史,并已获得FDA批准用于可植入气密套管。对于可植入的神经刺激器应用,对增加的输入/输出(I / O)气密引线的需求不断增长,可以通过开发一种新的共烧铂/氧化铝多层陶瓷技术来解决,该技术可支持300多个I / O,这在商业上是不可行的。使用七种不同粒径的铂粉来开发不同的导电共烧油墨,以控制铂和氧化铝之间的致密化不匹配。还优化了燃烧曲线(升温速率,燃尽和保持时间)以及燃烧气氛和浓度(氢气(湿/干),空气,中性,真空)。铂和氧化铝在还原的气氛中表现出合金形成反应。任何化合物的形成都可以增加金属/陶瓷界面的结合力,从而提高密封性。在减少的气氛中制造的穿通管表现出比其他气氛明显更好的性能。通过通孔结构分级的钨/铂比率的复合结构(纯W,50/50 W / Pt,80/20 Pt / W和纯Pt)与用于油墨金属化的其他材料的性能相比表现出最佳性能对铂和氧化铝的高温反应的研究(以前未曾报道过)表明,在还原气氛下的低温下,会形成具有四方结构的Pt3Al或Pt8Al21。将样品加热到1350°C以上时会形成立方Pt3Al。这种立方结构是Pt-Al合金在高温下的平衡状态。氧化铝溶解在铂油墨中,并重新沉积为表面涂层。在共烧样品和涂覆在99.6 Wt%氧化铝上并在1550°C烧成的纯铂薄膜上均观察到了这一点。根据铂颗粒的大小,提出了不同的机制来描述这种行为。

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    Karbasi Ali;

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  • 年度 2012
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