Design of thermal control systems for testing of electronics

摘要

In the electronic component manufacturing industry, most components are subjected to a full functional test before they are sold. Depending on the type of components, these functional tests may be performed at room temperature, at cold temperature, or at high temperature (-50C to 1600C) depending on the type of component and intended market. The thermal management of these components during testing forms two basic issues that need to be addressed. The first issue is the heating or cooling of devices to the desired temperature prior to being tested, and the second issue concerns temperature control during the actual functional test. This thesis covers the design, modeling and testing of two prototype systems. One system uses a low cost IR heating system to preheat bulk devices to a target temperature, prior to the actual functional test. Theory shows that the limits on temperature ramp rates are imposed by the device package configuration and carrier configuration. The results from the prototype system show that the IR heating chamber is an effective low cost, low volume system for uniformly heating a wide range of device and carrier types. The second prototype system uses high performance jet impingement coupled with laser heating to actively control the temperature of a high power density device during a functional test. Experimental results from the prototype system are presented and design guidelines for future systems are developed. The theory for temperature control is developed and the effects of package design and test sequence design on the temperature control limits are studied.