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Dependence of nanocrystal formation and charge storage/retention performance of a tri-layer memory structure on germanium concentration and tunnel oxide thickness

机译:纳米晶体形成的依赖性和三层存储器结构的电荷存储/保持性能对锗浓度和隧道氧化物厚度的影响

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摘要

The effect of germanium (Ge) concentration and the rapid thermal oxide (RTO) layer thickness on the nanocrystal formation and charge storage/retention capability of a trilayer metal-insulator-semiconductor device was studied. We found that the RTO and the capping oxide layers were not totally effective in confining the Ge nanocrystals in the middle layer when a pure Ge middle layer was used for the formation of nanocrystals. From the transmission electron microscopy and secondary ion mass spectroscopy results, a significant diffusion of Ge atoms through the RTO and into the silicon (Si) substrate was observed when the RTO layer thickness was reduced to 2.5 nm. This resulted in no (or very few) nanocrystals formed in the system. For devices with a Ge+SiO₂ co-sputtered middle layer (i.e., lower Ge concentration), a higher charge storage capability was obtained than with devices with a thinner RTO layer, and the charge retention time was found to be less than in devices with a thicker RTO layer.
机译:研究了锗(Ge)浓度和快速热氧化物(RTO)层厚度对三层金属-绝缘体-半导体器件的纳米晶体形成和电荷存储/保持能力的影响。我们发现,当使用纯Ge中间层形成纳米晶体时,RTO和覆盖氧化物层不能完全有效地将Ge纳米晶体限制在中间层中。根据透射电子显微镜和二次离子质谱的结果,当RTO层厚度减小到2.5 nm时,观察到Ge原子通过RTO大量扩散到硅(Si)衬底中。这导致在系统中没有(或很少)形成纳米晶体。对于具有Ge + SiO2共溅射中间层(即,较低的Ge浓度)的器件,与具有较薄RTO层的器件相比,获得了更高的电荷存储能力,并且发现电荷保持时间比具有RTO层的器件要短。较厚的RTO层。

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