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Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability

机译：倒装芯片连接方法：评估供应商工艺变化和供应商关系对产品可靠性影响的方法

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by Sherry L. Clough.

机译：由雪莉（Cherry L.Clough）

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Clough Sherry L. (Sherry Lynn) 1969-;
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年度 1998
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原文格式 PDF
正文语种 eng
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3. AIDEA: a methodology for supplier evaluation and selection in a supplier-based manufacturing environment [J] . Teresa Wu, Dan Shunk, Jennifer Blackhurst, International Journal of Manufacturing Technology and Management . 2007,第2期

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5. Effects of Shocks and Stability of Supplier-Customer Relationships on Suppliers' Capital Structure [D] . Oliveira, Mauro G. 2018

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6. Toward a conceptualization of supplier-switching processes in business relationships [O] . Lena E. Bygballe -1

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Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability

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