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Technology and market analysis of standard electronic photonic package

机译:标准电子光子封装技术与市场分析

摘要

Electronic industry will suffer a major turn around in the near future. The current infrastructure will no longer be able to support the increasing data rates. All the disadvantages of copper as current legacy are amplified with the level of bandwidth we are going to experience soon. On the other hand, photonic industry is in the need of finding a new demand source to be able to bring back the state of industry to the "boom" era. With both conditions in mind, it is likely for photonic and electronic industry to emerge. However, the platform for the collaboration has not been mature enough. One of the biggest problems in the photonic industry is the high cost of the package. This, so far, has been one of the major issues holding the industry from gaining back to its golden era. In order to overcome this barrier, standardization has been suggested to be implemented in the industry. This thesis examines the current state of optoelectronic industry, as a convergence of photonic and electronic industry. More specifically, the condition of lack of standardization is analyzed and proven to be the case.
机译:在不久的将来,电子行业将发生重大转变。当前的基础架构将不再能够支持不断增长的数据速率。铜作为现有技术的所有缺点随着我们不久将要经历的带宽水平而被放大。另一方面,光子产业需要寻找新的需求来源,以使产业状态回到“繁荣”时代。考虑到这两个条件,光子和电子工业很有可能出现。但是,协作平台还不够成熟。光子工业中最大的问题之一是封装的高成本。到目前为止,这已成为阻碍该行业回到黄金时代的主要问题之一。为了克服该障碍,已经建议在行业中实现标准化。本文考察了光电子产业融合的光电子产业现状。更具体地说,对缺乏标准化的条件进行了分析并证明是这种情况。

著录项

  • 作者

    Abdi Fatwa Firdaus;

  • 作者单位
  • 年度 2006
  • 总页数
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类

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