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Axiomatic system design : chemical mechanical polishing machine case study

机译:公理系统设计:化学机械抛光机案例研究

摘要

Axiomatic design is investigated as a design methodology for large or complex system design. Particular considerations of system design are described and the suitability of axiomatic design for such considerations is discussed. Then, tools to enable successful application of axiomatic design to systems are developed. The tools are expressed as theorems for axiomatic system design. The first theorem describes conditions for equivalence of FRs, and helps define the relationships within a design matrix. The second theorem describes a method of using only leaf levels to represent a system, and re-sequencing the design to achieve a decoupled matrix. Therefore, some types of coupling at high levels may be reduced or eliminated. The third theorem defines the decomposition strategy that is necessary to make axiomatic design compatible with object-oriented simulation models that are created starting with the high levels of the decomposition. The fourth and fifth theorems present a new method for considering and increasing system robustness to external noise factors during the conceptual design phase. While techniques for increasing robustness to external noise factors are known, integrating them into axiomatic design has not been shown previously. A case study of the design of a machine tool system for polishing silicon wafers using chemical mechanical polishing (CMP) is presented. The CMP system architecture is decomposed from top level requirements using the principles of axiomatic design, and the theorems developed in this thesis. The CMP system was designed and fabricated at MIT by a team of students, and has demonstrated excellent capability to remove material from the surface of a wafer while offering increased control of the removal profile.
机译:公理化设计是作为大型或复杂系统设计的一种设计方法进行研究的。描述了系统设计的特殊考虑因素,并讨论了针对此类考虑的公理设计的适用性。然后,开发了将公理设计成功应用于系统的工具。这些工具表示为公理系统设计的定理。第一个定理描述了等价的条件,并帮助定义设计矩阵内的关系。第二个定理描述了一种方法,该方法仅使用叶级别表示系统,然后对设计重新排序以实现解耦矩阵。因此,可以减少或消除某些类型的高水平耦合。第三个定理定义了分解策略,该分解策略是使公理化设计与从分解的高层次开始创建的面向对象的仿真模型兼容所必需的。第四和第五定理提出了一种新方法,用于在概念设计阶段考虑并提高系统对外部噪声因素的鲁棒性。虽然已知用于增加对外部噪声因素的鲁棒性的技术,但是以前没有显示将其集成到公理设计中。介绍了使用化学机械抛光(CMP)抛光硅片的机床系统设计的案例研究。根据公理化设计原理,从最高要求分解了CMP系统的体系结构,并建立了本文的定理。 CMP系统是由一群学生在MIT设计和制造的,具有出色的去除晶片表面材料的能力,同时提供了对去除轮廓的更好控制。

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