The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here.
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