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Wettability of low Sn solders on integrated circuit package metallizations

机译：低sn焊料在集成电路封装金属化上的润湿性

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by Michelle Wendy Gabriel.

机译：由Michelle Wendy Gabriel撰写。

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Gabriel Michelle Wendy;
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年度 1983
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正文语种 eng
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1. A study on wettability and formation of intermetallic phase between Co-Cr-Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages [J] . Kyaw Tin Tin, Tunthawiroon Phacharaphon, Kanlayasiri Kannachai, Intermetallics . 2020,第1期

机译：CO-CR-MO合金与SN-焊料中金属间相的润湿性和形成的研究用作倒装芯片封装下的凸块金属化下的潜力
2. Metallurgical Reaction of the Sn-3.5Ag Solder and Sn-37Pb Solder with Ni/Cu Under-Bump Metallization in a Flip-Chip Package [J] . Chien-Sheng Huang, Jenq-Gong Duh, Yen-Ming Chen Journal of Electronic Materials . 2003,第12期

机译：倒装芯片封装中Sn-3.5Ag焊料和Sn-37Pb焊料与Ni / Cu凸点下金属化的冶金反应
3. In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits [J] . Huang Y. T., Chen C. H., Lee B. H., Journal of Electronic Materials . 2016,第12期

机译：三维集成电路中Cu-Sn和Ni-Sn临界焊接长度的原位电迁移
4. Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering [C] . Peng Sun, Cristina Andersson, Xicheng Wei, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis . 2006

机译：在回流焊接后，在Sn-Co-Cu，Sn-Ag-Cu和共晶Sn-Cu焊点中的金属间化合物形成在化学镜（P）浸没Au表面饰面
5. Interfacial reaction of Sn-based solder joint in the package system. [D] . Gu, Huandi. 2014

机译：封装系统中锡基焊点的界面反应。
6. Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits [O] . Xi Zhang, Chengkun Xu, Kyuchul Chong, 2011

机译：湿化学用于混合信号集成电路中射频交叉对话隔离的大孔硅中镍金属化研究
7. Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages [O] . M. D. Cheng, S. Y. Chang, S. F. Yen, 2004

机译：在Sn-3.8Ag-0.7Cu和Sn-20英寸-2Ag-0.5Cu焊球栅格的回流和老化期间形成的金属间化合物在SN-3.8AG-0.7CU和SN-20IN-2AG-0.5CU焊球栅格阵列套件

Wettability of low Sn solders on integrated circuit package metallizations

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