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Graded InGaN Buffers for Strain Relaxation in GaN/InGaN Epliayers Grown on Sapphire

机译:用于在蓝宝石上生长的GaN / InGaN Epliayers中的应变弛豫的渐变InGaN缓冲器

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摘要

Graded InGaN buffers are employed to relax the strain arising from the lattice and thermal mismatches between GaN/InGaN epilayers grown on sapphire. The formation of V-pits in linearly graded InGaN/GaN bulk epilayers is illustrated. The V-pits were sampled using Atomic Force Microscopy and Scanning Electron Microscopy to examine their variation from the theoretical geometry shape. We discovered that the size of the V-pit opening in linearly graded InGaN, with and without GaN cap layer, has a Gaussian distribution. As such, we deduce that the V-pits are produced at different rates, as the growth of the InGaN layer progresses. In Stage I, the V-pits form at a slow rate at the beginning and then accelerate in Stage II when a critical thickness is reached before decelerating in Stage III after arriving at a mean size. It is possible to fill the V-pits by growing a GaN cap layer. It turns out that the filling of the V-pits is more effective at lower growth temperature of the GaN cap layer and the size of the V-pits opening, which is continued in to GaN cap layer, is not dependent on the GaN cap layer thickness. Furthermore, graded InGaN/GaN layers display better strain relaxation as compared to conventionally grown bulk GaN. By employing a specially design configuration, the V-pits can be eliminated from the InGaN epilayer.
机译:采用分级的InGaN缓冲剂来缓和由蓝宝石上生长的GaN / InGaN外延层之间的晶格和热失配引起的应变。说明了线性渐变的InGaN / GaN本体外延层中V坑的形成。使用原子力显微镜和扫描电子显微镜对V型坑进行采样,以检查其与理论几何形状的差异。我们发现,线性渐变InGaN中具有和不具有GaN覆盖层的V坑开口的尺寸具有高斯分布。因此,我们推论随着InGaN层的增长,V坑的产生速率不同。在第I阶段,V形坑在开始时以缓慢的速度形成,然后在达到临界厚度时在第II阶段加速,然后在达到平均尺寸后在第III阶段减速。可以通过生长GaN盖层来填充V坑。事实证明,在GaN盖层的较低生长温度下V坑的填充更有效,并且延续到GaN盖层中的V坑开口的尺寸不依赖于GaN盖层厚度。此外,与常规生长的块状GaN相比,梯度InGaN / GaN层显示出更好的应变松弛。通过采用特殊的设计配置,可以从InGaN外延层中消除V坑。

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