Manufacturing a DRAM module that is error free is a very difficult process. This process is becoming more difficult when only utilizing the current methods for producing an error free DRAM. Error correction codes (ECCs) and cell replacement are two methods currently used in isolation of each other in order to solve two of the problems with this manufacturing process: increasing reliability and increasing yield, respectively. Possible solutions to this problem are proposed and evaluated qualitatively in discussion. Also, a simulation model is produced in order to simulate the impacts of various strategies in order to evaluate their effectiveness.
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