首页> 外文OA文献 >Strain path change effect on dislocation microstructure of multicrystalline copper sheets
【2h】

Strain path change effect on dislocation microstructure of multicrystalline copper sheets

机译:应变路径变化对多晶铜板位错组织的影响

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

In this study, coarse-grained copper sheets were subjected to tension-rolling and rolling-tension strain path sequences. In both cases, two different types of strain path change were studied: the tensile and rolling directions were parallel and normal to each other. TEM observations of deformed samples showed the typical dislocation structures for the prestraining paths in tension and rolling. Special microband features, not observed during prestrain, were found during the second strain path, whatever the sequence and type of strain path change. The microstructure observed during reloading is discussed in terms of the sequence and type of strain path change, parallel or normal. The frequency of appearance of microbands is discussed in terms of the activity of new slip systems, i.e. not active during the prestrain path and connected with the number of the active slip systems after reloading. The results from this study, obtained for coarse-grained multicrystalline copper sheets, are compared with previous ones for fine and medium-grained copper.
机译:在这项研究中,对粗晶粒铜片进行了拉伸-轧制和轧制-拉伸应变路径序列。在这两种情况下,都研究了两种不同类型的应变路径变化:拉伸方向和滚动方向平行且彼此垂直。变形样品的TEM观察显示了拉伸和轧制中预应变路径的典型位错结构。无论应变路径的顺序和类型如何变化,都在第二应变路径中发现了预应变期间未观察到的特殊微带特征。根据应力路径变化的顺序和类型(平行或正常)讨论了在重新加载期间观察到的微观结构。根据新的滑动系统的活动来讨论微带出现的频率,即在预应变路径期间不活动,并与重新加载后的活动滑动系统的数量相关。这项研究的结果是将粗晶粒多晶铜板获得的结果与先前的细晶粒和中晶粒铜板的结果进行了比较。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号