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Behind the Nature of Titanium Oxide Excellent Surface Passivation and Carrier Selectivity of c-Si

机译:氧化钛的性质背后优异的表面钝化和c-si的载流子选择性

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摘要

We present an expanded study of the passivation properties of titanium dioxide (TiO) on p-type crystalline silicon (c-Si). We report a low surface recombination velocity (16 cm/s) for TiO passivation layers with a thin tunnelling oxide interlayer (SiO or AlO) on p-type crystalline silicon (c-Si). The TiO films were deposited by thermal atomic layer deposition (ALD) at temperatures in the range of 80-300  ̊C using titanium tetrachloride (TiCl) as Ti precursor and water as the oxidant. The influence of TiO thickness (5, 10, 20 nm), presence of additional tunneling interlayer (SiO or AlO), and post-deposition annealing temperature were investigated.We have observed that that SiO and AlO interlayers enhance the TiO passivation of c-Si. TiO2 thin film passivation layers alone result in lower effective carrier lifetime. Further annealing at 200  ̊C in N gas enhances the surface passivation quality of TiO tremendously.
机译:我们提出了对p型晶体硅(c-Si)上的二氧化钛(TiO)钝化性能的扩展研究。我们报道了在p型晶体硅(c-Si)上具有薄隧穿氧化物中间层(SiO或AlO)的TiO钝化层的低表面复合速度(16 cm / s)。以四氯化钛(TiCl)为Ti前驱体,以水为氧化剂,通过热原子层沉积(ALD)在80-300°C的温度范围内沉积TiO膜。研究了TiO厚度(5、10、20 nm),附加隧穿中间层(SiO或AlO)的存在以及沉积后退火温度的影响。我们发现SiO和AlO中间层增强了c-TiO的钝化硅。单独的TiO2薄膜钝化层会降低有效载流子寿命。在氮气中在200°C下进一步退火可大大提高TiO的表面钝化质量。

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