Contamination, potential bias and humidity effects on electrical performance and corrosion reliability of electronic devices

摘要

This paper describes the interactions between flux contamination, humidity and po-tential bias and their effect on corrosion reliability. Water layer formation on laminate surfaces and behavior of different solder flux chemistries with humid conditions have been studied, together with their influence on electrical performance of electronics. The effect of the type of laminate’s solder mask on the formation of water film and droplets was investigated for two different types: smooth glossy and rough matte sur-face finishes of the solder mask. The impact of potential bias on the electrical re-sponse of electronics is estimated as a function of contamination type under cycling humid conditions. The results show the correlation between the ionic contamination type and water layer formation on surfaces in the presence of the flux residue.