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Physical masking process for integrating micro metallic structures on polymer substrate:Physical mask

机译:用于在微聚合物基板上集成微金属结构的物理掩模工艺:物理掩模

摘要

Integration of micro metallic structures in polymer devices is a broad multi-disciplinary research field, consisting of various combinations of mechanical, chemical and physical fabrication methods. Each of the methods has its specific advantages and disadvantages. Some applications like surface plasmon devices need micro metallic structures on a polymer substrate with an uniform metal layer thickness in the nanometer range. A well known fabrication process to achieve such metallic surface pattern on polymer substrate is photolithography which involves an expensive mask and toxic chemicals. The current study shows a novel approach for fabricating thin micro metallic structures on polymer substrates using a simple physical mask and a PVD equipment. The new process involves fewer process steps, it is cost effective and suitable for high volume industrial production. Current study suggests that physical masking process in combination with PVD can be a cost effective alternative to photolithography when thin metallic structures on a polymers substrate are concerned.
机译:聚合物设备中微金属结构的集成是一个广泛的跨学科研究领域,由机械,化学和物理制造方法的各种组合组成。每种方法都有其特定的优点和缺点。诸如表面等离子体激元器件的一些应用需要在聚合物衬底上具有在纳米范围内具有均匀金属层厚度的微金属结构。在聚合物基底上实现这种金属表面图案的众所周知的制造工艺是光刻法,其涉及昂贵的掩模和有毒化学物质。当前的研究显示了一种使用简单的物理掩模和PVD设备在聚合物基板上制造薄金属微结构的新颖方法。新工艺涉及较少的工艺步骤,具有成本效益,适用于大批量工业生产。当前的研究表明,当涉及到聚合物基板上的薄金属结构时,与PVD结合使用物理掩膜工艺可以是一种经济有效的替代方法。

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