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High aspect ratio MEMS capacitor for high frequency impedance matching applications

机译:高纵横比mEms电容器,用于高频阻抗匹配应用

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摘要

We present a microelectromechanical tunable capacitor with a low control voltage, a wide tuning range and adequate electrical quality factor. The device is fabricated in a single-crystalline silicon layer using deep reactive ion etching (DRIE) for obtaining high-aspect ratio ( 20) parallel comb-drive structures with vertical sidewalls. The process sequence for fabrication of the devices uses only one lithographic masking step and can be completed in a short time. The fabricated device was characterized with respect to electrical quality factor, tuning range, self-resonance frequency and transient response and it was found that the device is a suitable passive component to be used in impedance matching applications, band-pass filtering or voltage controlled oscillators in the Very High Frequency (VHF) and Ultra High Frequency (UHF) bands.
机译:我们提出了一种具有低控制电压,宽调谐范围和足够电气品质因数的微机电可调电容器。该器件使用深反应离子刻蚀(DRIE)在单晶硅层中制造,以获得具有垂直侧壁的高纵横比(> 20)的平行梳状驱动结构。用于制造器件的工艺序列仅使用一个光刻掩模步骤,并且可以在短时间内完成。对制成的器件进行了电气质量因数,调谐范围,自谐振频率和瞬态响应的表征,发现该器件是适用于阻抗匹配应用,带通滤波或压控振荡器的无源器件。在甚高频(VHF)和超高频(UHF)频带中。

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