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EM Simulation Accuracy Enhancement for Broadband Modeling of On-Wafer Passive Components

机译:用于晶圆无源元件宽带建模的Em仿真精度增强

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摘要

This paper describes methods for accuracy enhancement in broadband modeling of on-wafer passive components using electromagnetic (EM) simulation. It is shown that standard excitation schemes for integrated component simulation leads to poor correlation with on-wafer measurements beyond the lower GHz frequency range. We show that this is due to parasitic effects and higher-order modes caused by the excitation schemes. We propose a simple equivalent circuit for the parasitic effects in the well-known ground ring excitation scheme. An extended L-2L calibration method is shown to improve significantly the accuracy of the on-wafer component modeling, when applied to parasitic effect removal associated with the excitation schemes.
机译:本文介绍了使用电磁(EM)仿真在晶圆上无源元件的宽带建模中提高精度的方法。结果表明,用于集成组件仿真的标准激励方案导致与较低GHz频率范围以外的晶圆上测量的相关性较差。我们证明这是由于激励方案引起的寄生效应和高阶模。针对众所周知的接地环激励方案中的寄生效应,我们提出了一个简单的等效电路。当应用于与激励方案相关的寄生效应去除时,扩展的L-2L校准方法可以显着提高晶片上组件建模的准确性。

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