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>Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab
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Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab
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机译:CMOS晶圆厂制造的晶圆级封装RF-MEMS开关
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摘要
Reports on wafer-level packaged RF-MEMS switches fabricated in a commercial CMOS fab. Switch fabrication is based on a metal surface micromachining process. A novel wafer-level packaging scheme is developed, whereby the switches are housed in on-chip sealed cavities using benzocyclobutene (BCB) as the bonding and sealing material. Measurements show that the influence of the wafer-level package on the RF performance can be made very small
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