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Application of Finite Element, Phase-field, and CALPHAD-based Methods to Additive Manufacturing of Ni-based Superalloys

机译:有限元,相场和基于CaLpHaD的方法在中国的应用   镍基高温合金的添加剂制造

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摘要

Numerical simulations are used in this work to investigate aspects ofmicrostructure and microsegregation during rapid solidification of a Ni-basedsuperalloy in a laser powder bed fusion additive manufacturing process. Thermalmodeling by finite element analysis simulates the laser melt pool, with surfacetemperatures in agreement with in situ thermographic measurements on Inconel625. Geometric and thermal features of the simulated melt pools are extractedand used in subsequent mesoscale simulations. Solidification in the melt poolis simulated on two length scales. For the multicomponent alloy Inconel 625,microsegregation between dendrite arms is calculated using the Scheil-Gulliversolidification model and DICTRA software. Phase-field simulations, using Ni-Nbas a binary analogue to Inconel 625, produced microstructures with primarycellular/dendritic arm spacings in agreement with measured spacings inexperimentally observed microstructures and a lesser extent of microsegregationthan predicted by DICTRA simulations. The composition profiles are used tocompare thermodynamic driving forces for nucleation against experimentallyobserved precipitates identified by electron and X-ray diffraction analyses.Our analysis lists the precipitates that may form from FCC phase of enrichedinterdendritic compositions and compares these against experimentally observedphases from 1 h heat treatments at two temperatures: stress relief at 1143 K(870{\deg}C) or homogenization at 1423 K (1150{\deg}C).
机译:在这项工作中使用数值模拟来研究激光粉末床熔融添加剂制造过程中镍基高温合金快速凝固过程中的微观结构和微观偏析方面。通过有限元分析进行热建模可以模拟激光熔池,其表面温度与Inconel625上的现场热成像测量结果一致。提取模拟熔池的几何特征和热特征,并将其用于后续的中尺度模拟。在两个长度尺度上模拟熔池中的凝固。对于多组分合金Inconel 625,使用Scheil-Gulliversolidification模型和DICTRA软件计算枝晶臂之间的微偏析。使用Ni-Nbas类似于Inconel 625的二元模拟物进行的相场模拟,产生的微结构具有原代细胞/树突状臂间距,与实验观察到的微结构所测得的间距一致,并且微偏析程度低于DICTRA模拟所预测的程度。成分分布图用于比较热力学驱动力,以形成核对通过电子和X射线衍射分析鉴定的实验观察到的沉淀物。两个温度:在1143 K(870°C)时消除应力或在1423 K(1150°C)时均质化。

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