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Development of a solderbump technique for contacting a three-dimensional multi electrode array

机译：用于接触三维多电极阵列的焊球技术的发展

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摘要

The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing

机译：介绍了一种焊料凸点技术在接触多电极传感器/执行器系统中的应用。根据文献改编的技术可以成功缩小到心距120 µm的55×55 µm颠簸

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Frieswijk T.A.; Bielen J.A.; Rutten Wim;
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年度 1995
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4. Development of a solder bump technique for contacting a three-dimensional multi electrode array [C] . Theo A. Frieswijk, Jeroen A. Bielen, Wim L.C. Rutten 1995 IEEE engineering in medicine and biology 17th annual conference and 21st Canadian medical and biological engineering conference . 1997

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5. Improved 2D and 3D resistivity surveys using buried electrodes and optimized arrays: The multi-electrode resistivity implant technique (MERIT) [D] . Kiflu, Henok Gidey. 2016

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6. Recording long-term potentiation of synaptic transmission by three-dimensional multi-electrode arrays [O] . Maksym V Kopanitsa, Nurudeen O Afinowi, Seth GN Grant 2006

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7. Development of a solderbump technique for contacting a three-dimensional multi electrode array [O] . Frieswijk T.A., Bielen J.A., Rutten W.L.C. 1995

机译：开发用于接触三维多电极阵列的焊料凸点技术

Development of a solderbump technique for contacting a three-dimensional multi electrode array

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