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Nanoindentation of polysilicon and single crystal silicon: molecular dynamics simulation and experimental validation.

机译:多晶硅和单晶硅的纳米压痕:分子动力学模拟和实验验证。

摘要

This paper presents novel advances in the deformation behaviour of polycrystalline and single crystal silicon using molecular dynamics (MD) simulation and validation of the same via nanoindentation experiments. In order to unravel the mechanism of deformation, four simulations were performed: indentation of a polycrystalline silicon substrate with a (i) Berkovich pyramidal and a (ii) spherical (arc) indenter, and (iii and iv) indentation of a single crystal silicon substrate with these two indenters. The simulation results reveal that high pressure phase transformation (HPPT) in silicon (Si-I to Si-II phase transformation) occurred in all cases; however, its extent and the manner in which it occurred differed significantly between polycrystalline silicon and single crystal silicon, and was the main driver of differences in the nanoindentation deformation behaviour between these two types of silicon. Interestingly, in polycrystalline silicon, the HPPT was observed to occur more preferentially along the grain boundaries than across the grain boundaries. An automated dislocation extraction algorithm (DXA) revealed no dislocations in the deformation zone, suggesting that HPPT is the primary mechanism in inducing plasticity in silicon.
机译:本文利用分子动力学(MD)模拟方法,通过纳米压痕实验验证了多晶硅和单晶硅的变形行为,并提出了新的进展。为了揭示变形机理,进行了四个模拟:用(i)Berkovich金字塔形和(ii)球形(弧形)压头对多晶硅衬底进行压痕,以及(iii和iv)单晶硅的压痕具有这两个压头的基板。仿真结果表明,在所有情况下都发生了硅中的高压相变(HPPT)(Si-I至Si-II相变)。然而,它的程度和发生方式在多晶硅和单晶硅之间明显不同,并且是这两种硅之间纳米压痕变形行为差异的主要驱动力。有趣的是,在多晶硅中,观察到HPPT沿晶界比沿晶界更优先出现。自动位错提取算法(DXA)揭示变形区没有位错,这表明HPPT是诱导硅可塑性的主要机制。

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