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Basic Development of Electrochemical Machining (Part 1) Facile Small Additive Machining with Local Electroplating

机译:电化学加工的基础发展(第1部分)局部电镀的小型加法加工

摘要

In this paper,the electrochemical machining method is developed to conduct the facile equipment for low cost and small scale manufacturing. This method applies plating and correct mechanical control to micro fabrication. And, it can be additive micro machining in one process. Long and thin probe electrode (anode) brings the localization of deposit in workpiece (cathode). And,the probe electrode scanning with electric current supplying is enabled to generate the arbitrary pattern of deposition. Moreover,it is verified that the deposition growth is proportional to electric quantity. In addition,because of ion migration,the copper(foreign metal as bath metal ion) deposition is generated without nickel deposition in cathode workpiece with using copper probeelectrode (anode) in electrolytic Ni bath.
机译:本文研究了电化学加工方法,以进行低成本,小批量生产的设备的研制。该方法将电镀和正确的机械控制应用于微加工。并且,它可以在一个过程中进行附加微加工。细长的探针电极(阳极)使工件(阴极)中的沉积物局部化。并且,能够利用通电进行扫描的探针电极产生任意的沉积图案。此外,已证实沉积物的生长与电量成正比。此外,由于离子迁移,在电解镍浴中使用铜探针电极(阳极)在阴极工件中生成了铜(作为浴金属离子的外来金属)沉积而没有镍沉积。

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