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Mechanical properties of nanostructured copper/hydrogenated amorphous carbon multilayer films grown in a low base vacuum system

机译:在低基真空系统中生长的纳米结构铜/氢化无定形碳多层膜的机械性能

摘要

Nanostructured copper/hydrogenated amorphous carbon (Cu/a-C:H) multilayer films have been deposited in a low base vacuum system (base pressure 1x10-3 Torr) and studied for their mechanical properties. The analysis shows very low residual stress (below 1 GPa), moderate nanohardness (H) and elastic modulus (E) of the resultant films. Further these films have been studied for their plastic deformation energy and elastic recovery. Atomic force microscopic analysis reveals the nanostructured morphology and low surface roughnesses of the resultant films. Estimated roughnesses values have also been correlated with the experimental measured H values. The presence of Cu in these structures have been confirmed by time of flight-secondary ion mass spectroscopy, X-ray photoelectron spectroscopy and energy dispersive X-ray analysis.
机译:纳米结构的铜/氢化非晶碳(Cu / a-C:H)多层膜已在低基础真空系统(基础压力1x10-3 Torr)中沉积,并对其机械性能进行了研究。分析显示所得膜的残余应力非常低(低于1 GPa),中等的纳米硬度(H)和弹性模量(E)。进一步研究了这些薄膜的塑性变形能和弹性回复率。原子力显微镜分析揭示了所得膜的纳米结构形态和低表面粗糙度。估计的粗糙度值也已与实验测得的H值相关联。通过二次飞行离子质谱,X射线光电子能谱和能量色散X射线分析的时间证实了这些结构中Cu的存在。

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