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Investigation of the use of solderjet bumping for joining the thin-walled glass package of a complex mechatronic lens implant

机译：研究使用焊料喷射凸点连接复杂机电一体化透镜植入物的薄壁玻璃封装

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Rheinschmitt Liane; Burkhardt Thomas; Nagel Jörg A.; Beckert Erik; Gengenbach Ulrich; Bretthauer Georg;
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年度 2012
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1. Solderjet bumping packaging technique optimization for the miniaturization of laser devices [J] . P. Ribes-Pleguezuelo, B. Septriani, S. Zhang, JEOS:RP . 2017 ,第1期

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2. A Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Film [J] . Pao-Yun Tang, Wei-Hao Sun, Kei-Hsiung Yang SID International Symposium: Digest of Technology Papers . 2009 ,第2期

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3. EUROPEAN SOFT DRINKS INDUSTRY JOINS THE "CLOSE THE GLASS LOOP" TO OPTIMIZE GLASS PACKAGING CIRCULAR ECONOMY [J] . Kanch group Kanch . 2020 ,第4期

机译：欧洲软饮料行业加入“关闭玻璃环”以优化玻璃包装循环经济
4. Bond strength and stability of solderjet bumping packaging technique for laser device miniaturization [C] . Brigitta Septriani, Pol Ribes Pleguezuelo, Erik Beckert, International Conference and Exhibition on Integration Issues of Miniaturized Systems . 2018

机译：激光装置小型化焊接凸起包装技术的粘接强度与稳定性
5. A theoretical and computational investigation of complex fluids and glasses. [D] . Lombardo, Thomas G. 2010

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6. Investigation of Bone Growth in Additive-Manufactured Pedicle Screw Implant by Using Ti-6Al-4V and Bioactive Glass Powder Composite [O] . Tu-Ngoc Lam, Minh-Giam Trinh, Chih-Chieh Huang, 2020

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7. Second-Generation Implants for Load Introduction into Thin-Walled CFRP-Reinforced UHPC Beams: Implant Optimisation and Investigations of Production Technologies [O] . Benjamin Kromoser, Oliver Gericke, Mathias Hammerl, 2019

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Investigation of the use of solderjet bumping for joining the thin-walled glass package of a complex mechatronic lens implant

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