首页> 外文OA文献 >Bond strength of a pit-and-fissure sealant associated to etch-and-rinse and self-etching adhesive systems to saliva-contaminated enamel: individual vs. simultaneous light curing
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Bond strength of a pit-and-fissure sealant associated to etch-and-rinse and self-etching adhesive systems to saliva-contaminated enamel: individual vs. simultaneous light curing

机译:与蚀刻和冲洗以及自蚀刻粘合剂系统相关的凹坑和裂缝密封剂与唾液污染的牙釉质的粘合强度:单独与同时光固化

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摘要

This study evaluated in vitro the shear bond strength (SBS) of a resin-based pit-and-fissure sealant [Fluroshield (F), Dentsply/Caulk] associated with either an etch-and-rinse [Adper Single Bond 2 (SB), 3M/ESPE] or a self-etching adhesive system [Clearfil S3 Bond (S3), Kuraray Co., Ltd.] to saliva-contaminated enamel, comparing two curing protocols: individual light curing of the adhesive system and the sealant or simultaneous curing of both materials. Mesial and distal enamel surfaces from 45 sound third molars were randomly assigned to 6 groups (n=15), according to the bonding technique: I - F was applied to 37% phosphoric acid etched enamel. The other groups were contaminated with fresh human saliva (0.01 mL; 10 s) after acid etching: II - SB and F were light cured separately; III - SB and F were light cured together; IV - S3 and F were light cured separately; V - S3 and F were light cured simultaneously; VI - F was applied to saliva-contaminated, acid-etched enamel without an intermediate bonding agent layer. SBS was tested to failure in a universal testing machine at 0.5 mm/min. Data were analyzed by one-way ANOVA and Fisher's test (α=0.05).The debonded specimens were examined with a stereomicroscope to assess the failure modes. Three representative specimens from each group were observed under scanning electron microscopy for a qualitative analysis. Mean SBS in MPa were: I-12.28 (±4.29); II-8.57 (±3.19); III-7.97 (±2.16); IV-12.56 (±3.11); V-11.45 (±3.77); and VI-7.47 (±1.99). In conclusion, individual or simultaneous curing of the intermediate bonding agent layer and the resin sealant did not seem to affect bond strength to saliva-contaminated enamel. S3/F presented significantly higher SBS than the that of the groups treated with SB etch-and-rinse adhesive system and similar SBS to that of the control group, in which the sealant was applied under ideal dry, noncontaminated conditions.
机译:这项研究在体外评估了与蚀刻和冲洗(Adper Single Bond 2(SB))相关的树脂基点缝密封胶[Fluroshield(F),Dentsply / Caulk]的剪切粘合强度(SBS)。 ,3M / ESPE]或将自蚀刻胶粘剂系统[可乐丽S3 Bond(S3),可乐丽有限公司)粘贴到唾液污染的牙釉质中,比较了两种固化方案:分别对胶粘剂系统和密封胶进行单独光固化或同时进行两种材料的固化。根据粘合技术,将来自45个声音的第三磨牙的中,远端牙釉质表面随机分为6组(n = 15):将I-F应用于37%磷酸蚀刻的牙釉质。酸蚀后,其他组被新鲜的人​​类唾液(0.01 mL; 10 s)污染:II-SB和F分别进行光固化。 III-SB和F一起光固化; IV-S3和F分别光固化; V-S3和F同时进行光固化;将VI-F涂在没有中间粘合剂层的唾液污染的酸蚀搪瓷上。在通用测试机中以0.5 mm / min的速度对SBS进行了故障测试。通过单向方差分析和Fisher检验(α= 0.05)分析数据。用体视显微镜检查剥离的样品,以评估破坏模式。在扫描电子显微镜下观察每组的三个代表性标本进行定性分析。以MPa为单位的平均SBS为:I-12.28(±4.29); II-8.57(±3.19); III-7.97(±2.16); IV-12.56(±3.11); V-11.45(±3.77);和VI-7.47(±1.99)。总之,中间粘合剂层和树脂密封剂的单独或同时固化似乎并未影响与唾液污染的牙釉质的粘合强度。 S3 / F的SBS显着高于用SB蚀刻和漂洗胶粘剂系统处理的组,与对照组的SBS相似,在密封,密封剂是在理想的干燥,无污染的条件下施加的。

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