This poster designed an active heat sink to cool a silicon CPU that dissipates 130 W of heat. The active CPU cooler is composed of a fan sitting above the heat sink, an aluminum radial heat sink, a copper heat spreader at the base of the heat sink and a copper core inside the heat sink. Various designs with different fin thickness, fin numbers and thermal spreader thickness were studied and the best design was selected. The selected design had 40 fins of 2mm thickness, and a Ø65mm thermal spreader with a thickness of 2mm. Parametric study was done on the selected design to see how the maximum temperature of the CPU varied when the thermal spreader diameter, copper core height and fan speed by the CPU was varied. All the studies conducted proved that the selected design was validated.
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