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Silicon nanostructures fabricated by scanning probe oxidation and tetra-methyl ammonium hydroxide etching

机译:通过扫描探针氧化和四甲基氢氧化铵蚀刻制成的硅纳米结构

摘要

[[abstract]]Fabrication of silicon nanostructures is a key technique for the development of monolithically integrated optoelectronic circuits. We demonstrated that the process of scanning probe microscope (SPM) oxidation and anisotropic tetra-methyl ammonium hydroxide (TMAH) etching is a low-cost and reliable method to produce smooth and uniform silicon nanostructures on a variety of silicon substrates. Etched structures with a pitch of 100 nm, positive- and negative-contrast structures, and features height greater than 100 nm have been produced on bare silicon, and Si3N4-coated and silicon-on-insulator wafers. Evolution of hexagonal pits on two-dimensional grid structures were shown to depend on the pattern spacing and orientation with respect to Si(110) crystal directions. We successfully combined SPM oxidation with traditional optical lithography in a mixed, multilevel patterning method for realizing micrometer-and nanometer-scale feature sizes, as required for photonic device designs. The combination of SPM oxidation and TMAH etching is a promising approach to rapid prototyping of functional nano-photonic devices.
机译:[[摘要]]硅纳米结构的制造是开发单片集成光电电路的关键技术。我们证明了扫描探针显微镜(SPM)氧化和各向异性四甲基氢氧化铵(TMAH)蚀刻的过程是一种低成本且可靠的方法,可以在各种硅基板上生产光滑且均匀的硅纳米结构。间距为100 nm的蚀刻结构,正和负对比度结构以及特征高度大于100 nm的蚀刻结构已经在裸露的硅以及涂覆有Si3N4的绝缘体上硅晶片上生产出来。二维网格结构上的六边形凹坑的演变显示,取决于图案间距和相对于Si(110)晶体方向的方向。我们成功地将SPM氧化技术与传统的光刻技术相结合,采用了一种混合的多层图案化方法,以实现光子器件设计所需的微米级和纳米级特征尺寸。 SPM氧化和TMAH蚀刻相结合是功能纳米光子器件快速原型制作的有前途的方法。

著录项

  • 作者

    Chien FSS;

  • 作者单位
  • 年度 2011
  • 总页数
  • 原文格式 PDF
  • 正文语种 [[iso]]en
  • 中图分类

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