[[abstract]]The metallization of aluminum nitride substrates by electroless copper plating is investigated. The AlN substrate is etched by 4% NaOH to study the correlation between the adhesion strength and the surface roughness of etched AlN substrate. Both the as-received nonpolished and the polished AlN are studied. For the nonpolished substrate, the adhesion strength increases from 130 kg/cm2 for the sample with an average surface roughness of 0.2 μm to 230 kgf/cm2 for one with an average surface roughness of 0.82 μm. For the polished substrate, the adhesion strength reaches 271 kg/cm2 with a surface roughness of 0.19 μm. Mechanical interlocking is the major cause for the adhesion strength between the Cu and AlN substrates. The polished substrate that was subsequently etched could form fine cavities on the AlN surface, and the microetching effect resulted in a stronger mechanical interlocking, which increases the adhesion strength
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机译：[[摘要]]研究了化学镀铜对氮化铝衬底的金属化。用4％NaOH腐蚀AlN衬底，以研究粘附强度与腐蚀后的AlN衬底表面粗糙度之间的相关性。研究了未经抛光和抛光的AlN。对于未抛光的基材，粘合强度从平均表面粗糙度为0.2μm的样品的130 kg / cm2增加到平均表面粗糙度为0.82μm的样品的230 kgf / cm2。对于抛光的基材，粘附强度达到271 kg / cm2，表面粗糙度为0.19μm。机械互锁是造成Cu和AlN基材之间粘附强度的主要原因。随后被蚀刻的抛光基板可能会在AlN表面上形成细小的空腔，并且微蚀刻效果导致更强的机械互锁，从而增加了粘合强度
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