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FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment

机译:FlexiVia ROM编译器可根据顶层金属分配在不同的通孔层上编程

摘要

[[abstract]]© 2006 Institute of Electrical and Electronics Engineers-We present a ROM compiler programmable from via 1 to via n - 2, where n is the number of metal layers. The layer on which the code via is landed can be selected by the user. With the coding being able to take place as close to the topmost metal as possible, the turnaround time for a revision is shortened. In this paper, we discuss the array assembly scheme and its impacts on the design considerations by the choice of strapping period.
机译:[[摘要]]©2006电气与电子工程师协会,我们提出了一种ROM编译器,可从via 1到via n-2对其进行编程,其中n是金属层的数量。用户可以选择登陆代码过孔的层。由于编码能够尽可能接近最顶层的金属进行,因此缩短了修订的周转时间。在本文中,我们通过选择捆扎周期来讨论阵列组装方案及其对设计考虑因素的影响。

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