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A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide

机译:一种快速光电图案法在聚醚酰亚胺上选择性电镀二维和三维微电路

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摘要

In this work, a method for the rapid synthesis of metallic microtracks on polyetherimide is presented. The method relies on the photosynthesis of silver nanoparticles on the surface of the polymer substrates from photosensitive silver chloride (AgCl), which is synthesized directly on the polyetherimide surface. The study reveals that the use of AgCl as a photosensitive intermediate accelerates the reactions leading to the formation of silver nanoparticles by up to two orders of magnitude faster than other photodecomposition schemes. The patterning can be conducted under blue light, with notable advantages over UV exposure. Polymers of significant interest to the microelectronics and 3D printing industries can be directly patterned by light using this photography-inspired technique at throughputs high enough to be commercially advantageous. Light exposures as short as a few seconds are sufficient to allow the direct metallization of the illuminated polyetherimide surface. The results show that the silver required for the seed layer is minimal, and the later copper electroless plating results in the selective growth of conductive tracks for circuitry on the light-patterned areas, both on flexible films and 3D printed surfaces.
机译:在这项工作中,提出了一种在聚醚酰亚胺上快速合成金属微径的方法。该方法依赖于直接在聚醚酰亚胺表面上合成的光敏氯化银(AgCl)在聚合物基质表面上银纳米粒子的光合作用。研究表明,使用AgCl作为光敏中间体,比其他光分解方案可加快导致银纳米颗粒形成的反应,速度最多快两个数量级。图案化可以在蓝光下进行,与紫外线暴露相比具有明显的优势。微电子和3D打印行业非常感兴趣的聚合物可以使用这种受照相启发的技术通过光直接图案化,其生产量足够高以具有商业优势。短短几秒钟的曝光时间足以使被照亮的聚醚酰亚胺表面直接金属化。结果表明,种子层所需的银极少,后来的化学镀铜导致在柔性膜和3D打印表面上的光图案化区域中,用于电路的导电迹线选择性生长。

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