Domain Integration and Cost Reduction in Electronic Product Design: a case study

摘要

This publication discusses domain integration of various engineering disciplines as an effective methodology to design new, innovative products or to upgrade existing ones. A case study illustrates how this approach is applied to the design process of a high performance electronic product. Thanks to newly developed cooling technologies, fewer constraints are put on the location of heat dissipating components with respect to their heat exchanger. This allows for more overall design flexibility, which can result in a more integrated product design with advantages in terms of performance, volume, weight and production efficiency