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Thermally activated conductance of a silicon inversion layer by electrons excited above the mobility edge

机译:通过在迁移率边缘上方激发的电子热激活硅反转层的电导

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摘要

The thermally activated conductivity sigma of an n-type inversion layer on a (100) oriented silicon surface and its derivative d sigma /dT were measured in the temperature range 1.4K-4.2K. Above T approximately=2.5K both the temperature dependence of (T/ sigma ) (d sigma /dT) and the relation between this quantity and sigma cannot be reconciled with a universal pre-exponential factor, i.e. the minimum metallic conductivity, but are shown to be satisfactorily described by a prefactor which is proportional to the temperature. The experimental results presented are consistent with activation of the number of mobile electrons above a mobility edge in the lowest sub-band, and indicate a mobility which is independent of both temperature and electron density.
机译:在1.4K-4.2K的温度范围内,测量了(100)取向的硅表面上的n型反型层的热活化电导率σ及其导数dσ/ dT。高于T大约= 2.5K时,(T / sigma)(d sigma / dT)的温度依赖性以及该量与sigma之间的关系都无法与通用的指数前因子(即最小金属电导率)相一致,但已显示用与温度成正比的预因子令人满意地描述。给出的实验结果与最低子带中迁移率边缘上方的移动电子数量的激活是一致的,并且表明迁移率与温度和电子密度均无关。

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