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Experimental verification of the diffusion theory for wet isotropic etching of si via circular mask openings

机译:通过圆形掩模开口对si的湿各向同性蚀刻的扩散理论的实验验证

摘要

Isotropic etching of silicon in HF based solutions is expected to be controlled by the diffusion offluorine to the silicon surface. In order to gain quantitative understanding of the process we studiedetching of Si in HF/HNO3/H2O via circular mask openings and compared the results with the theoreticalexpectations. The cavity edges due to etching under the mask were analyzed with a high precision byprocessing the optical microscope images. Dependence on the etching time and opening size wasinvestigated. The time dependence was verified with 1% precision. Dependence on the opening sizepredicted theoretically is not fully supported by the experiment. There is a small (4%) but clearlyobservable deviation from the theory. A small anisotropy was observed in perfect agreement with thecrystal orientation symmetry. The anisotropy becomes larger with the decrease of the opening size for(100) and (110) wafers.
机译:HF基溶液中硅的各向同性蚀刻有望通过氟向硅表面的扩散来控制。为了获得对该工艺的定量了解,我们研究了通过圆形掩模开口在HF / HNO3 / H2O中蚀刻硅的方法,并将结果与​​理论预期进行了比较。通过对光学显微镜图像进行处理,可以高精度地分析由于掩模下的蚀刻而引起的空腔边缘。研究了对蚀刻时间和开口尺寸的依赖性。验证了时间依赖性,精度为1%。实验并未完全支持理论上预测的开口尺寸的依赖性。与理论的偏差很小(4%),但可以明显观察到。观察到很小的各向异性,与晶体取向对称性完全吻合。随着(100)和(110)晶片的开口尺寸的减小,各向异性变大。

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