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Reduction of hydrogen-induced optical losses of plasma-enhanced chemical vapor deposition silicon oxynitride by phosphorus doping and heat treatment

机译:通过磷掺杂和热处理减少等离子体增强化学气相沉积氮氧化硅的氢致光学损失

摘要

Plasma enhanced chemical vapor deposition phosphoros-doped silicon oxynitride (SiON) layers with a refractive index of 1.505 were deposited from $N_{2}O$, 2% $SiH_{4}/N_{2}$, and 5% $PH_{3}/Ar$ gaseous mixtures. The $PH_{3}/Ar$ flow rate was varied to investigate the effect of the dopant to the layer properties. We studied the compositions and the chemical environment of phosphorus, silicon, oxygen, nitrogen and hydrogen in these layers by using x-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy. The number of N-H and O-H bonds, which are responsible for optical losses around 1.55 and 1.3 μm, decreases in the as-deposited layers with increasing phosphorus concentration. Furthermore, the bonded hyrogen in all P-doped layers has been eliminated after annealing at a temperature significantly lower than required for undoped silicon oxynitride layers, that is so to say 1000°C instead of 1150°C. The resulting optical loss in the entire third telecommunication window was well below 0.2dB/cm, making P-doped SiON an attractive material for demanding integrated optics applications.
机译:从$ N_ {2} O $,2%$ SiH_ {4} / N_ {2} $和5%$ PH_沉积具有1.505折射率的等离子增强化学气相沉积掺杂磷的氮氧化硅(SiON)层。 {3} / Ar $气体混合物。改变$ PH_ {3} / Ar $的流量,以研究掺杂剂对层性能的影响。我们通过使用X射线光电子能谱和傅立叶变换红外光谱法研究了这些层中磷,硅,氧,氮和氢的组成和化学环境。 N-H和O-H键的数量(约1.55和1.3μm左右)是造成光学损失的原因,随着磷浓度的增加,其沉积层的数量减少。此外,所有退火后的P掺杂层中的键合氢都已被消除,该温度明显低于未掺杂的氮氧化硅层所要求的温度,即1000℃而不是1150℃。在整个第三电信窗口中产生的光损耗远低于0.2dB / cm,这使得掺P的SiON成为了要求苛刻的集成光学应用的诱人材料。

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