For hybrid integration of an optical chip with an electronic chip with photo diodes and electronic processing, light must be coupled from the optical chip to the electronic chip. This paper presents a method to fabricate metal-free 45° quasi-total internal reflecting mirrors in optical chips that enable 90° out-of-plane light coupling between flip-chip bonded chips. This method is fully compatible with fabrication of conventional optical chips. The mirrors are created using anisotropic etching of 45° facets in a Si substrate followed by fabrication of optical structures. After removal of the mirror-defining Si structures by isotropic etching, the obtained air-optical structure interface directs the output of the waveguides to out-of-plane photo detectors that are mounted flip-chip on the optical chip. Simulations show a reflection efficiency of 72.3 %, while experimentally 47% was measured on a not fully optimized first batch.
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