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An integrated three-dimensional sound-intensity-probe

机译:集成的三维声强探头

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摘要

The development of an integrated three dimensional sound intensity probe is discussed. Although a 3D sound-intensity probe exists, by integrating sensors into one chip the size can be reduced. A small sensor is preferable, because it enables the user to do measurements on small objects, very close to objects and with a minimum disturbance of the sound field.udAn investigation to particle velocity sensors is done. The results give insight in an optimum sensor configuration and the influence of some parameters. Following the design and fabrication of a 3D-particle velocity sensor is discussed. The expected direction of sensitivity did not match the observed direction perfectly and objects in the vicinity were responsible for this behavior. The deviation can be compensated for, either in signal processing or an adapted design.udFurthermore a sound pressure sensitive device is developed. Instead of a membrane deflection principle a sound pressure –to- particle velocity transformer is used, and the particle velocity is measured. Integration of both sensor types on one chip can be achieved because the fabrication process is almost the same. Integrating the 3D particle velocity sensor with this sound pressure sensor results in a fully integrated three dimensional sound intensity sensor. Next, a sensor with four wires is developed, which has an improved self noise and a smaller size, enabling the development of an improved 3D sound intensity sensor.udInstead of dicing chips from the wafer, a ‘break out’ design proves to be a good solution to separate the chips from the wafer. The use of a small connector is of great advantage over existing assembly methods.udThe integrated 3D sensor can be used to measure the sound field near (small) sound sources. In an experiment demonstrating this it is also demonstrated that measuring particle velocity near a sound source has advantages compared to measuring the sound pressure.udMeasuring sound intensity is normally done by a sound intensity analyzer. With the use of a small analyzer near the sensor a small sound intensity system is made, expandable to a large array.
机译:讨论了集成的三维声强探头的开发。尽管存在3D声音强度探测器,但通过将传感器集成到一个芯片中,可以减小尺寸。最好使用小型传感器,因为它使用户能够在非常靠近物体的最小物体上进行测量,并且对声场的干扰最小。 ud对粒子速度传感器进行了研究。结果提供了最佳传感器配置和某些参数影响的见解。在设计和制造3D粒子速度传感器之后,将进行讨论。预期的灵敏度方向与观察到的方向不完全匹配,附近的物体对此行为负责。可以通过信号处理或自适应设计来补偿偏差。 ud此外,开发了声压敏感设备。代替膜偏转原理,使用了声压-颗粒速度转换器,并测量了颗粒速度。因为制造过程几乎相同,所以可以将两种传感器类型集成在一个芯片上。将3D粒子速度传感器与该声压传感器集成在一起,可以得到完全集成的三维声强传感器。接下来,开发出一种具有四根导线的传感器,该传感器具有改进的自噪声和更小的尺寸,从而可以开发出一种改进的3D声音强度传感器。 ud不是将晶圆上的芯片切成小块,而是证明了“突破”设计是从晶片分离芯片的好方法。与现有的组装方法相比,使用小型连接器具有很大优势。 ud集成的3D传感器可用于测量(小型)声源附近的声场。在证明这一点的实验中,还证明了与测量声压相比,测量声源附近的粒子速度具有优势。 ud测量声强通常由声强分析仪完成。通过在传感器附近使用小型分析仪,可以制造出一个小型声强系统,可以扩展到大阵列。

著录项

  • 作者

    Yntema Doekle Reinder;

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  • 年度 2008
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  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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