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Heat transfer and solidification processes of alloy melt with undercooling—Part II: Solidification model

机译:过冷合金熔体的传热和凝固过程 - 第二部分:凝固模型

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摘要

The solidification process of undercooled alloy melts has been clarified experimentally in Part I of this paper. In the present paper, using the experimental evidence, a solidification model linking macroscopic heat transfer and microscopic solidification is presented. The model reflects the microscopic solidification phenomena occurring until the thermodynamically unstable field shifts to equilibrium, consisting of three fundamental processes: (first stage) free growth, (second stage) crystal expansion with relaxation, and (third stage) equilibrium solidification. Based on this model, a numerical simulation is carried out for the temperature change, interface movement, and solute concentration distribution during the solidification of an undercooled Bi-Sn melt. Theoretical predictions of the temperature changes involving the recalescence, terminal time of the relaxation process, and microsegregation for the solidified texture agree quantitatively with experimental observations. © 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
机译:本文第一部分通过实验阐明了过冷合金熔体的凝固过程。在本文中,利用实验证据,提出了一种将宏观传热和微观凝固联系起来的凝固模型。该模型反映了直到热力学不稳定的场转变为平衡之前发生的微观凝固现象,该现象包括三个基本过程:(第一阶段)自由生长,(第二阶段)具有松弛的晶体膨胀和(第三阶段)平衡凝固。基于该模型,对过冷的Bi-Sn熔体凝固过程中的温度变化,界面运动和溶质浓度分布进行了数值模拟。关于温度变化的理论预测与重新观察,松弛过程的终止时间以及凝固组织的微观偏析有关,在定量上与实验观察一致。 ©2005 Acta Materialia Inc.,由Elsevier Ltd.发行。保留所有权利。

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