A Simulation of composite dispatching rules, CONWIP and push lot release in semiconductor fabrication

摘要

This paper evaluates dispatching rules and order release policies in two fabs representing two wafer fabrication modes, namely, ASIC and low-mix high-volume production. Order release policies were fixed-interval (push) release, and constant work-in-process, CONWIP (pull) policy. Following rigorous fab modeling and statistical analysis, new composite dispatching rules were found to be robust for system cycle time and due-date adherence measures, in both production modes.