Interface-state-induced degradation of GIDL current in n-MOSFETsunder hot-carrier stress

摘要

The dependence of increase in post-stress gate-induced-drain-leakage (GIDL) current in n-MOSFET's on creation of interface states (ΔDit) during hot-carrier stress with VG = 0.5 VD was investigated. An interface-trap-assisted tunneling conduction mechanism is proposed to account for the increase. The stress method of VG = 0.5 VD can generate a lot of interface traps near the valence band in thermal oxide samples, which is considerably suppressed in nitrided oxide samples. From the linear relationship between increase in post-stress GIDL current and created interface-state density during hot-carrier stress, ΔDit values can be estimated.