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Properties of Si-SiO2 interface traps due to low-energy Ar+ backsurface bombardment in n-channel nitrided MOSFETs

机译:n沟道氮化mOsFET中低能ar +背面轰击引起的si-siO2界面陷阱特性

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摘要

Flicker noise in backsurface gettered, nitrided n-channel MOSFETs is characterized over a wide range of temperatures and biases. The gettering time ranged from 10 to 40 minutes. The noise power spectra for devices with different gettering times are compared to the ungettered devices which serve as the control. It is found that flicker noise is reduced by backsurface gettering for short gettering times. A rebound in the noise magnitude is observed for long gettering times. Investigations of the temperature dependencies of the noise power spectra indicates that the low-frequency noise arises from thermal activation of carriers to traps at the Si-SiO2 interface. Backsurface gettering results in the modification of the energy distribution of the interface traps, probably due to stress relaxation at the Si-SiO2 interface.
机译:背面经过杂化的氮化n沟道MOSFET的闪烁噪声具有很宽的温度和偏置范围。吸气时间为10至40分钟。将具有不同吸杂时间的设备的噪声功率谱与用作控件的未接设备进行了比较。发现通过在短时间吸气时进行背面吸杂可以减少闪烁噪声。长时间吸杂会观察到噪声幅度的反弹。对噪声功率谱的温度依赖性的研究表明,低频噪声是由载流子热激活到Si-SiO2界面处的陷阱产生的。背面吸杂会导致界面陷阱的能量分布发生变化,这可能是由于Si-SiO2界面处的应力松弛所致。

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