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Improved electrical properties of metal-oxide-semiconductor capacitor with HfTiON gate dielectric by using HfSiON interlayer

机译:通过使用HfsiON中间层改善具有HfTiON栅极电介质的金属氧化物半导体电容器的电特性

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摘要

Metal-oxide-semiconductor (MOS) capacitor with HfTiONHfSiON stack structure as high- k gate dielectric is fabricated, and its electrical properties are compared with those of a similar device with HfTiON only as gate dielectric. Experimental results show that the device with HfTiONHfSiON gate dielectric exhibits better interface properties, lower gate leakage current, and enhanced high-field reliability. All these improvements should be attributed to the fact that the HfSiON buffer layer effectively blocks the diffusion of Ti atoms to the Si substrate, thus resulting in a Si O2 Si -like HfSiONSi interface. © 2007 American Institute of Physics.
机译:制备了具有HfTiONHfSiON堆叠结构作为高k栅极电介质的金属氧化物半导体(MOS)电容器,并将其电性能与仅以HfTiON作为栅极电介质的类似器件的电性能进行了比较。实验结果表明,采用HfTiONHfSiON栅介质的器件具有更好的界面性能,较低的栅漏电流和增强的高场可靠性。所有这些改进应归因于以下事实:HfSiON缓冲层有效地阻止了Ti原子向Si衬底的扩散,从而形成了类似于Si O2 Si的HfSiONSi界面。 ©2007美国物理研究所。

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