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Impacts of Ti on electrical properties of Ge metal-oxide-semiconductor capacitors with ultrathin high-κ LaTiON gate dielectric

机译:Ti对超薄高κLaTiON栅介质锗金属氧化物半导体电容器电性能的影响

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摘要

Ge Metal-Oxide-Semiconductor (MOS) capacitors with LaON gate dielectric incorporating different Ti contents are fabricated and their electrical properties are measured and compared. It is found that Ti incorporation can increase the dielectric permittivity, and the higher the Ti content, the larger is the permittivity. However, the interfacial and gate-leakage properties become poorer as the Ti content increases. Therefore, optimization of Ti content is important in order to obtain a good trade-off among the electrical properties of the device. For the studied range of the Ti/La 2O 3 ratio, a suitable Ti/La 2O 3 ratio of 14.7% results in a high relative permittivity of 24.6, low interfacestate density of 3.1 × 10 11 eV -1 cm -2, and relatively low gate-leakage current density of 2.0×10 -3 Acm -2 at a gate voltage of 1 V. © The Author(s) 2010.
机译:制备了具有掺入不同Ti含量的LaON栅极电介质的Ge金属氧化物半导体(MOS)电容器,并测量和比较了它们的电性能。发现掺入Ti可以增加介电常数,并且Ti含量越高,介电常数越大。但是,随着Ti含量的增加,界面和栅漏性能变差。因此,为了在器件的电性能之间获得良好的折衷,优化Ti含量很重要。对于Ti / La 2O 3比的研究范围,合适的Ti / La 2O 3比为14.7%时,相对介电常数高,为24.6,界面态密度低,为3.1×10 11 eV -1 cm -2,相对栅极电压为1 V时,栅极泄漏电流密度低至2.0×10 -3 Acm -2。©作者2010。

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