Dramatic improvements in the cost, performance, and reliability of a digital system can he obtained if the system is integrated on a single chip. Many systems are sufficiently complex that the die size resulting from integration would be very large with a low probability of producing a perfect, functioning die. Since there is a real need for larger integrated systems than can be fabricated free of defects, it is likely that techniques which canudlocate and "wire-around" defects will be useful and will allow the die-size to increase, perhaps to full-wafer size.
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