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Transparent conductive oxide TCO buffer layer effect on the resistive switching process in metal TCO TiO2 metal assemblies

机译:透明导电氧化物TCO缓冲层对金属TCO TiO2金属组件中的电阻转换过程有影响

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摘要

The effect of transparent conductive oxide TCO buffer layer on the insulator matrix and on the resistive switching process in the metal TiO2 TCO metal assembly was studied depending on the material of TCO ITO In2O3 0.9 SnO2 0.1 or SnO2 or ZnO . First time electro physical studies and near edge x ray absorption fine structure NEXAFS studies were carried out jointly and in the same point of the sample providing the direct experimental evidence that switching process influences strongly the lowest unoccupied bands and local atomic structure of the TiO2 layers. It was established that TCO layer in metal TiO2 TCO metal assembly is an additional source of oxygen vacancies for TiO2 film. The RL RH states are achieved presumably with formation rupture of electrically conductive path of oxygen vacancies. The inserting the Al2O3 thin layer between TiO2 and TCO layers restricts to some extent processes of migration of oxygen ions and vacancies and does not permit to realize the anti clockwise bipolar resistive switching in Au TiO2 Al2O3 ITO Au assembly. The greatest value of the ratio RH RL is observed for assembly with SnO2 buffer layer that will provide to implement the maximum set of intermediate states recording analog data and increases the density of information recording in this case
机译:根据TCO ITO In2O3 0.9 SnO2 0.1或SnO2或ZnO的材料,研究了透明导电氧化物TCO缓冲层对绝缘体基体和金属TiO2 TCO金属组件的电阻转换过程的影响。首次并在样品的同一点上进行了首次电物理研究和近边缘X射线吸收精细结构NEXAFS研究,提供了直接的实验证据,即切换过程强烈影响TiO2层的最低未占据能带和局部原子结构。已经确定,金属TiO2中的TCO层TCO金属组件是TiO2薄膜中氧空位的另一个来源。 RL RH状态大概是由于氧空位的导电路径的破裂而达到的。在TiO2和TCO层之间插入Al2O3薄层在一定程度上限制了氧离子的迁移和空位的过程,并且不允许在Au TiO2 Al2O3 ITO Au组件中实现逆时针双极电阻转换。在与SnO2缓冲层组装时观察到比率RH RL的最大值,在这种情况下,它将提供实现记录模拟数据的最大中间状态集并增加信息记录的密度

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