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The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion

机译:室温自退火的意义 采用高压扭转加工的高纯铜

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摘要

High purity copper was processed by high-pressure torsion (HPT) at room temperature and then stored at room temperature for periods of up to 6 weeks to investigate the effect of self-annealing. Hardness measurements were recorded both at 48 h after HPT processing and after various storage times. The results show the occurrence of recovery near the edges of the discs after processing through 1/2 and 1 turn and this leads to a significant drop in the measured hardness values which is accompanied by microstructural evidence for abnormal grain growth. Conversely, there was no recovery, and therefore no hardness drops, after processing through 5 and 10 turns. X-ray line profile analysis was used to determine the crystallite sizes and dislocation densities at 1 h after HPT and after storage for different times. The results show a good thermal stability in high purity Cu after processing through more than 1 turn of HPT but care must be exercised in recording hardness measurements when processing through only fractional or very small numbers of turns.
机译:高纯度铜在室温下通过高压扭转(HPT)进行处理,然后在室温下保存长达6周,以研究自退火的效果。在HPT处理后48小时和各种存储时间后记录硬度测量值。结果表明,经过1/2和1圈加工后,在圆盘边缘附近出现了恢复现象,这导致测得的硬度值显着下降,并伴有晶粒异常生长的微观结构证据。相反,经过5到10圈加工后没有恢复,因此没有硬度下降。 X射线线轮廓分析用于确定HPT后1小时和储存不同时间后的微晶尺寸和位错密度。结果表明,经过1匝以上的HPT加工后,高纯度铜具有良好的热稳定性,但是当仅进行零分或极少量的匝数加工时,在记录硬度测量值时必须格外小心。

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