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Towards monolithic integration of germanium light sources on silicon chips

机译:在硅芯片上实现锗光源的单片集成

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摘要

Germanium (Ge) is a group-IV indirect band gap semiconductor, and therefore bulk Ge cannot emit light efficiently. However, the direct band gap energy is close to the indirect one, and significant engineering efforts are being made to convert Ge into an efficient gain material monolithically integrated on a Si chip. In this article, we will review the engineering challenges of developing Ge light sources fabricated using nano-fabrication technologies compatible with Complementary Metal-Oxide-Semiconductor (CMOS) processes. In particular, we review recent progress in applying high-tensile strain to Ge to reduce the direct band gap. Another important technique is doping Ge with donor impurities to fill the indirect band gap valleys in the conduction band. Realization of carrier confinement structures and suitable optical cavities will be discussed. Finally, we will discuss possible applications of Ge light sources in potential photonics-electronics convergent systems.
机译:锗(Ge)是IV组间接带隙半导体,因此体Ge无法有效地发光。然而,直接的带隙能量接近于间接的带隙能量,并且正在进行巨大的工程努力以将Ge转化为单片集成在Si芯片上的有效增益材料。在本文中,我们将回顾开发使用与互补金属氧化物半导体(CMOS)工艺兼容的纳米制造技术制造的Ge光源的工程挑战。特别是,我们回顾了在向Ge中施加高应变以减少直接带隙的最新进展。另一重要技术是用施主杂质掺杂Ge,以填充导带中的间接带隙谷。将讨论载流子限制结构和合适的光腔的实现。最后,我们将讨论Ge光源在潜在的光电子集成系统中的可能应用。

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